CIPSA TEC INDIA PVT. LTD.

Infrastructure

Our state-of-the-art facilities are designed to meet the highest standards of quality and efficiency.

Our CIPSA-TEC journey began in December 2005, growing into a leading name in PCB manufacturing. We strengthened our foundation by acquiring the business of RIC, a pioneer in the Indian PCB industry, originally established in 1987 in collaboration with UNICAP, Taiwan.

With a state-of-the-art manufacturing setup, we operate one of the most advanced facilities in the country. Our Tumkur plant, originally a Sanmina setup from Germany, with a 12,000 Sqm built-up area.

As the One-of-the-largest PCB manufacturer in India, we achieved threefold growth from 2005 to 2009, further solidifying our position in the industry.

Inside Our Manufacturing Excellence

Discover how we deliver high-quality PCBs with advanced technology, precision, and efficiency. Our state-of-the-art facility is equipped with the latest European machinery and a highly skilled workforce to ensure superior results.

Process Flow Block Diagram

Our shearing capabilities include advanced equipment:

  • Semi-automatic sheet cutters: Ensuring precise cutting of PCB sheets.
  • Auto-edge matte machines: Maintaining edge quality and consistency.

Utilizing state-of-the-art CNC drilling machines:

  • POSALUX, GIGA, and PLURITEC technologies: Equipped with X-ray capabilities for precise and accurate drilling of holes.
  • Ensures optimal alignment and dimensional accuracy in PCB production.

Enhanced de-burring and de-smear capabilities:

  • International supplier technologies: Utilized for effective removal of burrs and residues.
  • Vertical de-smear lines: Ensuring clean surfaces essential for subsequent PCB processing steps.

Efficient processing of plated through holes:

  • Vertical PTH lines: Ensuring reliable electrical connections across PCB layers.
  • Enhances the durability and performance of PCBs in various applications.

Advanced technologies for precise image transfer:

  • UV-SKT and OLEC systems: Ensuring accurate transfer of PCB designs onto substrate materials.
  • Supports intricate and detailed PCB layouts required for complex electronic devices.

Specialized capabilities in pattern plating:

  • Metezka vertical pattern plating line: Consistently delivers uniform and precise patterning on PCB surfaces.
  • Fischer scope: Utilized for precise measurement and quality control during the plating process.

Efficient strip, etch, and strip processes:

  • Schmid technologies: Ensuring efficient and controlled processing of PCB layers.
  • Enhances the reliability and performance of PCBs through optimized manufacturing processes.

Effective preparation of solder mask surfaces:

  • IS Pumice and semi-automatic Thieme printing machines: Used for thorough pre-cleaning of solder mask surfaces.
  • ORC exposure: Ensuring precise application and alignment of solder mask materials.

Versatile surface finishing capabilities:

  • Utilizing PENTA, Quick Silver, and Sunshine technologies: Offering a range of surface finish options to meet diverse application requirements.
  • Enhances PCB durability, solderability, and overall performance in varied environmental conditions.

Precision V-scoring capabilities:

  • TELMEC and HRF technologies: Ensuring accurate and clean V-scoring cuts on PCB panels.
  • Facilitates efficient PCB separation and assembly processes.

Advanced CNC routing capabilities:

  • POSALUX and SCHMOL: Enabling intricate and precise shaping of PCBs according to design specifications.
  • Supports the production of complex PCB geometries required for modern electronic devices.

Comprehensive electrical testing capabilities:

  • ATG- MAKE EXALINE, MANIA UNIVARSAL BBT: Providing thorough and reliable electrical testing of PCBs.
  • Ensures high-quality standards and adherence to specifications before product delivery.

Secure and professional final packing processes:

  • KALLFASS automatic vacuum packing machines: Ensuring safe and protective packaging of finished PCB products.
  • Enhances product integrity during storage, shipping, and handling.

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