Sl. No. |
Parameters |
Capabilites |
| 1 | Base Laminate Material | FR4, CEM 3, Metal clad |
| 2 | Board Thickness | 0.70 mm To 2.40 mm |
| 3 | Layer Count | 02 to 08 LAYER |
| 4 | Board Finish | H A S L - Tin Lead |
| H A L - Lead Free | ||
| E N I G | ||
| Carbon & Peelable | ||
| 5 | Finished Copper Thickness | 2 oz |
| 6 | Minimum Track width & Space | |
| 18/18 Micron Base Coper | 0.1524 mm [6 Mill] | |
| 35/35 Micron Base Coper | 0.1778 mm[7 Mill] | |
| 70/70 Micron Base Coper | 0.2286 mm [9 Mill] | |
| 7 | Ground To Copper Spacing | 0.2032 mm [8 Mill] |
| 8 | Minimum Inner Layer Isolation | 0.2032 mm [8 Mill] |
| 9 | Minimum Finished Hole Size | 0.3 mm [12 Mill] |
| 10 | Minimum Annular Ring For Inner & Outer Layer | |
| 11 | Minimum Epoxy Hatch | NO SPECIFIC OF NOW [12 Mils proposed] |
| 12 | BARE BOARD TESTING | |
| A). JIG METHOD | SPLIT NET TEST POSSIBILITY TO WORK OUT CASE TO CASE | |
| Minimum QFP For Testing | 10 X 50 mils Pad with 20 Mils Pitch | |
| Max Test Area [SINGLE SIDED] | 440 X 300 mm | |
| Max Test Area [DOUBLE SIDED] | 405 X 325 mm | |
| B). FLYING PROBE METHOD | ||
| Minimum QFP For Testing | NO LIMITATOIN EXCEPT TIME & COST | |
| Max Test Area [UP TO 1.6 mm] | 420 X 350 mm | |
| Max Test Area [1.6 TO 6.0 mm] | 520 X 400 mm | |
| 13 | Minimum SOLDER MASK DAM | 4 MILS DAM WITH A GAP OF 10 MILS |
| 14 | Maximum Peelable Thickness | 300 MICRONS |
| 15 | Max Dia can be covered with Peelable | 3.0 mm |
| 16 | Board Dimension Tolerance | +/- 0.15 mm |
| 17 | Minimum Slot Width | 0.80 mm |
| 18 | PTH Tolerance | . +0.1/-0..5 mm |
| 19 | PRESS FIT TOLERANCE | .+/-0.05 mm |
| 20 | CARBON TO CARBON SPACING | 12 MILS |
| 21 | V-SCORE angle | 30 DEGREE |
| 22 | Web Thickness | +/- 0.1 mm |
| 23 | GOLD Plating Thickness | 0.05 MICRONS |
| 24 | Min. Copper Edge To Board Edge | 0.20 mm |